I-Low-Temperature Co-Fired Ceramic (LTCC) Technology

Uhlolojikelele

I-LTCC (I-Low-Temperature Co-Fired Ceramic) iwubuchwepheshe obuthuthukisiwe bokuhlanganisa ingxenye obavela ngo-1982 futhi kusukela ngaleso sikhathi isibe yisixazululo esivamile sokuhlanganisa okwenziwayo. Iqhuba ukuqanjwa okusha emkhakheni wengxenye ye-passive futhi imele indawo ekhulayo ekhulayo embonini yezogesi

Inqubo Yokukhiqiza

1.Ukulungiselela Okubalulekile:Impushana yobumba, impushana yengilazi, nezibophezelo zemvelo ziyaxutshwa, ziphonswe kumateyipu aluhlaza ngokusakazwa kwe-tape, futhi zomiswe23.
2. Ukwenza iphethini:Imifanekiso yesekethe iphrintwa isikrini kumateyipu aluhlaza kusetshenziswa i-conductive silver paste. Ukumba i-laser yokuphrinta ngaphambili kungenziwa ukuze kwakhiwe i-interlayer vias egcwaliswe nge-conductive paste23.
3. Lamination and Sintering:Izendlalelo ezinamaphethini amaningi ziqondaniswe, zistakiwe, futhi zicindezelwe ngokushisa. Umhlangano ushiswe ku-850-900°C ukuze wakhe i-monolithic 3D structure12.
4. Ngemuva kokucubungula:Ama-electrode abonisiwe angase ahlanganiswe ne-tin-lead alloy plating ukuze i-solderability3.

Ukuqhathanisa ne-HTCC

I-HTCC (I-High-Temperature Co-Fired Ceramic), ubuchwepheshe bangaphambili, ayinazo izithasiselo zengilazi ezingqimbeni zayo zobumba, ezidinga i-sintering ku-1300–1600°C. Lokhu kukhawulela izinto zekhondatha ezinsimbini ezincibilika kakhulu njenge-tungsten noma i-molybdenum, ebonisa ukusebenza okuphansi uma kuqhathaniswa nesiliva noma igolide le-LTCC.

Izinzuzo Eziyinhloko

1.Ukusebenza kwe-High-Frequency:Izinto ezisetshenziswayo ze-dielectric eziphansi (ε _r = 5–10) ezihlanganiswe nesiliva eline-conductivity ephezulu zenza i-high-Q, izingxenye zefrikhwensi ephezulu (10 MHz–10 GHz+), okuhlanganisa izihlungi, izimpondo, nezihlukanisi zamandla13.
2.Ikhono Lokuhlanganisa:Isiza amasekhethi ezendlalelo eziningi ashumeke izingxenye ze-passive (isb, ama-resistor, ama-capacitor, ama-inductors) namadivayisi asebenzayo (isb., ama-IC, ama-transistors) abe amamojula ahlangene, asekela imiklamo ye-System-in-Package (SiP)14.
3.I-Miniaturization:Izinto ze-high-ε _r (ε _​​r >60) zinciphisa unyawo lwama-capacitor nezihlungi, zenza izici zefomu ezincane35.

Izinhlelo zokusebenza

1.I-Consumer Electronics:Ibusa omakhalekhukhwini (80%+ ukwabelana kwemakethe), amamojula e-Bluetooth, i-GPS, namadivayisi we-WLAN
2.Izimoto kanye ne-Aerospace:Ukwenyuka kokutholwa ngenxa yokuthembeka okuphezulu ezindaweni ezinokhahlo
3.Amamojula Athuthukile:Kufaka phakathi izihlungi ze-LC, ama-duplexer, ama-baluns, namamojula angaphambili we-RF

I-Chengdu Concept Microwave Technology CO., Ltd ingumkhiqizi ochwepheshile wezingxenye ze-5G/6G RF e-China, okuhlanganisa isihlungi se-RF lowpass, isihlungi se-highpass, isihlungi se-bandpass, isihlungi se-notch/i-band stop filter, i-duplexer, i-Power divider kanye ne-directional coupler. Zonke zingenziwa ngezifiso ngokuya ngezidingo zakho.
Siyakwamukela kuwebhu yethu:www.concept-mw.comnoma sifinyelele ku:sales@concept-mw.com