Ukusetshenziswa kwe-LTCC Technology ku-Wireless Communications

1.I-High-Frequency Component Integration

Ubuchwepheshe be-LTCC buvumela ukuminyana okuphezulu kokuhlanganiswa kwezingxenye ze-passive ezisebenza kububanzi bemvamisa ephezulu (10 MHz kuya kumabhendi we-terahertz) ngokusebenzisa izakhiwo ze-ceramic ze-multilayer kanye nezinqubo zokuphrinta ze-conductor yesiliva, okuhlanganisa:

2.Okuhlungayo:Izihlungi ze-Novel LTCC ze-multilayer bandpass, ezisebenzisa idizayini enepharamitha ene-lumped-parameter kanye nokudubula ngokubambisana okunokushisa okuphansi (800–900°C), zibalulekile eziteshini eziyisisekelo ze-5G nama-smartphone, acindezela ngempumelelo ukuphazamiseka okungaphandle kwe-band nokuthuthukisa ukuhlanzeka kwesignali. Izihlungi ezihlanganiswe ekugcineni ezigoqwe ngamagagasi amamilimitha zithuthukisa ukwenqatshwa kwe-stopband futhi zinciphise usayizi wesekethe ngokuxhumanisa okuphambanayo kanye nezakhiwo ezishumekiwe ze-3D, ukuhlangabezana nezidingo ze-radar nesethelayithi.

3.Ama-Antenna Nezihlukanisi Zamandla:Izinto ezingaguquguquki ze-dielectric eziphansi (ε _r =5–10) ezihlanganiswe nokuphrinta okunembe kakhulu kwesiliva okunamathiselwe kusekela ukwakhiwa kwezimpondo ze-Q, ama-coupler, nezihlukanisi zamandla, okuthuthukisa ukusebenza kwe-RF front-end.

Izicelo Eziyinhloko ku-5G Communications

I-1.5G Base Stations & Terminals:Izihlungi ze-LTCC, ezinezinzuzo zosayizi ohlangene, umkhawulokudonsa obanzi, nokuthembeka okuphezulu, seziphenduke izixazululo ezivamile ze-5G Sub-6GHz kanye nama-millimeter-wave bands, ezithatha indawo yezihlungi zendabuko ze-SAW/BAW.

2.RF Amamojula Angaphambili:Ukuhlanganiswa kwezingxenye ze-passive (izihlungi ze-LC, ama-duplexer, ama-baluns) anama-chips asebenzayo (isb., izikhulisamandla) kumamojula we-compact SiP kunciphisa ukulahleka kwesignali futhi kuthuthukisa ukusebenza kahle kohlelo.

3.Technical Izinzuzo Driving Innovation

I-High-Frequency & Thermal Performance:Ukulahleka kwe-dielectric ephansi (tanδ <0.002) kanye nokuhanjiswa kwe-thermal okuphezulu (2–3 W/m·K) kuqinisekisa ukudluliswa kwesignali yemvamisa ephezulu ezinzile kanye nokuphathwa okushisayo okuthuthukisiwe kwezinhlelo zokusebenza zamandla aphezulu57.

Amandla Okuhlanganiswa kwe-3D:Ama-multilayer substrates anezingxenye ze-passive ezishumekiwe (ama-capacitor, ama-inductors) anciphisa izidingo zokukhweza phezulu, afinyelele >50% ukuncishiswa kwevolumu yesekethe.

I-Chengdu Concept Microwave Technology CO., Ltd ingumkhiqizi ochwepheshile wezingxenye ze-5G/6G RF e-China, okuhlanganisa isihlungi se-RF lowpass, isihlungi se-highpass, isihlungi se-bandpass, isihlungi se-notch/i-band stop filter, i-duplexer, i-Power divider kanye ne-directional coupler. Zonke zingenziwa ngezifiso ngokuya ngezidingo zakho.

Siyakwamukela kuwebhu yethu:www.concept-mw.comnoma sifinyelele ku:sales@concept-mw.com